WBOND - Acquisition and installation of a wafer bonding system
| Topic: | STEM impulses |
|---|---|
| Type of funding: | Individual funding programmes |
| Funded institution: |
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The Prisma funding enables Prof. Dr. Roy Knechtel, Professor of Autonomous Intelligent Sensors, to do practical work on wafer bonding by purchasing his own wafer bonding system.
Goals
Wafer bonding as a technological step for stacking and joining semiconductor wafers is an important process for microelectronics, microsystems and sensor technology. It is used to produce output substrates for processors, memories and pressure sensors.
Involved persons:
Prof. Dr.-Ing. Roy Knechtel
Hochschule Schmalkalden
Detailed information:
| Topic: | STEM impulses |
|---|---|
| Type of funding: | Individual funding programmes |
| Target group: | CZS Endowed Professors |
|---|---|
| Funding budget: | 71.000 € |
| Period of time: | Juni 2021 - Mai 2022 |
Funded institution:
